Method of manufacturing members

ABSTRACT

According to the present invention, a method of manufacturing members, with a plurality of members being formed together on a single substrate and the substrate being cut in such a manner as to be divided into individual members after a characteristic evaluation of the members is carried out, comprises the steps of, carrying out the evaluation of the characteristics and applying ink marks of a prescribed height to surfaces of members deemed to have been defective, affixing a protective tape having an adhesive layer of a thickness equal to or greater than the height of the ink marks, to the surface of the substrate and cutting the substrate in such a manner as to be divided into individual members after a lower surface of the substrate has been ground or polished.

BACKGROUND OF THE INVENTION

The present invention relates to a method of manufacturing members wheresemiconductor chips or other members are cut out from a substrate.

Conventionally, in the manufacture of semiconductor devices such asdiscrete transistors, bipolar integrated circuits (hereinafter referredto as "IC's"), metal oxide semiconductor (MOS) IC's and compoundsemiconductor devices etc., Charge Coupled Device (hereinafter referredto as "CCD's") light receiving elements for CCD area sensors/linearsensors, and optical filters etc., large numbers of members such aschips or filters etc. have been collectively manufactured from a singlesubstrate.

For example, with semiconductor devices and CCD devices, large numbersof chips have been manufactured taking silicon wafers as substrates,while with optical filters, large numbers of filters have beenmanufactured taking boro-silicated glass or quartz glass plates as thesubstrates.

Whichever members are manufactured, the characteristics etc. of each ofthe members are to be evaluated via an inspection process before thelarge number of members formed on the substrate are cut out, todetermine whether or not members are defective. An ink mark is thenapplied to a member when this member is deemed to be defective.

In the case of semiconductor devices or CCD devices, from the point ofview of achieving thinness in the integrated circuits, the lower surfaceof the wafer is gradually ground before cutting out so as to thin-outthe overall thickness. With filters, the lower surface is polished toremove debris that may have become attached to this lower surface and toremove any damage incurred.

However, with this kind of method of manufacturing a member, when anevaluation inspection of the characteristics etc. is carried out afterthe lower surface has been ground etc., cracking or breaking off occursin the substrate as a result of pin pressure during characteristicmeasurements or impacts at the time of physical distribution. Thesubstrate can be made extremely thin, however, as a result of grinding,but as the size of substrates has progressed in recent years, thiscracking etc. has become more striking.

Further, grinding the lower surface after the evaluation inspection hasbeen carried out has been considered, but in this case, if defectivemembers are applied with ink marks, pressure exerted on the lower sideof the substrate during subsequent lower surface grinding etc. isconcentrated on the members via the ink marks to cause the members tocrack. This is due to the applied ink marks elevated from the surface ofthe substrate to make the surface nonuniform and the pressure duringgrinding is concentrated to act onto the substrate from the positions ofthe ink marks depending mainly on the height and hardness of the inkmarks and the hardness of the protective tape attached to the surface ofthe substrate during the grinding of the lower surface.

To solve this, rather than applying ink marks to defective membersduring evaluation inspection, a method was considered where informationpertaining to defective members was recorded on a floppy disc etc. asmap data. However, if the evaluated information was recorded a mediumother than the substrate, it was necessary to transport the substratetogether with the medium for carrying out subsequent processes such as,for example, die bonding. Further, defect determination data could notbe accurately played back as a result of mistakes made when inputtingthe map data and the inability not to be able to make a match withsubstrate member positions. A large-scale data management system wastherefore necessary to enable defect determination information to bereliably reproduced.

SUMMARY OF THE INVENTION

The present invention is therefore a method of manufacturing membersthat sets out to solve these kinds of problems.

According to the present invention, a method of manufacturing members,with a plurality of members being formed together on a single substrateand the substrate being cut in such a manner as to be divided intoindividual members after a characteristic evaluation of the members iscarried out, comprises the steps of, carrying out the evaluation of thecharacteristics and applying ink marks of a prescribed height tosurfaces of members deemed to have been defective, affixing a protectivetape having an adhesive layer of a thickness equal to or greater thanthe height of the ink marks, to the surface of the substrate and cuttingthe substrate in such a manner as to be divided into individual membersafter a lower surface of the substrate has been ground or polished.

The adhesive strength of the adhesive layer for the protective tape maybe smaller than the adhesive strength of the ink marks with respect tothe substrate.

Further, according to the present invention, a method of manufacturingmembers, with a plurality of members being formed together on a singlesubstrate and the substrate being cut in such a manner as to be dividedinto individual members after a characteristic evaluation of the membersis carried out, comprises the steps of carrying out the evaluation ofthe characteristics and applying ink marks of a prescribed height tosurfaces of members deemed to have been defective, affixing aself-peeling protective tape, having an adhesive layer of a thicknessequal to or greater than the height of the ink marks, to the surface ofthe substrate, cutting the substrate together with protective tape so asto divide the substrate into individual members after a lower surface ofthe substrate has been ground or polished with the protective tapeaffixed and applying a prescribed energy to each individual member afterdividing, in such a manner that the protective tape is made to peelitself off.

The self-peeling protective tape may peel itself in response to thermalenergy.

The adhesive layer of the protective tape may be an ultra-violet curingtype, a thermal foam peeling type or a surface active agent-containingtype.

According to the present invention, after ink marks have been applied tothe surfaces of members that have been deemed to be defective in thecharacteristic evaluation, a protective tape having an adhesive layer ofa thickness equal to or greater than the thickness of the ink mark isapplied. In this way, the ink marks are buried in the adhesive layer andthe protective tape is flat with respect to the surface of thesubstrate. Because of this, even if grinding or polishing of the lowersurface of the substrate is carried out with the adhesive tape affixed,pressure applied from the lower surface of the substrate at this time isdistributed evenly over the whole of the surface of the protective tape.This pressure is therefore not concentrated on the ink mark portion andlocalized concentration of the load at the substrate is avoided.

Moreover, by using a self-peeling protective tape, after the substratehas been divided up with the protective tape still in place, theprotective tapes can be individually self-peeled by supplying aprescribed amount of energy to each individual member after dividing.Still further, the members can be transported for processes afterdividing with the protective tape still attached because the protectivetape can be easily peeled even after the individual members have beendivided-up. This means that the period for which damage to the surfacesof the members is prevented and the period for which the attaching ofdebris to the surfaces of the members is prevented is made long.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A through FIG. 1C are schematic cross-sectional views illustratinga first representative of a first embodiment of the present invention;

FIG. 2A through FIG. 2C are schematic cross-sectional views illustratinga second representative of the first embodiment of the presentinvention;

FIG. 3A through FIG. 3C are schematic cross-sectional views illustratinga first representative of a second embodiment of the present invention;and

FIG. 4A and FIG. 4B are schematic cross-sectional views illustrating asecond representative of the second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

First Embodiment

The following is an embodiment, based on the drawings, of a method ofmanufacturing members according to the present invention.

FIG. 1A through FIG. 1C are schematic cross-sectional views illustratinga first representative of a first embodiment of the present inventionand FIG. 2A through FIG. 2C are schematic cross-sectional viewsillustrating a second representative of the first embodiment.

The members 10 to be made according to this embodiment are, for example,silicon or compound semiconductor chips such as discrete transistors,bipolar IC's or MOS IC's, photomic devices such as CCD area sensors, CCDlinear sensors, lasers or photodiodes or optical filters etc. used inLCD's (liquid crystal devices). A substrate 1 may be a silicon wafer, acompound semiconductor wafer, an optical substrate, an optical glassplate or a quartz glass plate.

In any one of the above, the object of manufacture is plurality ofmembers 10 manufactured by dividing-up a single layer substrate 1.

First, in this first embodiment, the characteristics of the plurality ofmembers 10 formed from the substrate 1 are evaluated, with ink marksbeing applied at the members for which the characteristics are evaluatedto be unsuitable, as shown in FIG. 1A.

During this time, the substrate 1 is of a thickness that ensures thatcracking or breaking off due to the application of a prescribed pinpressure does not occur.

As the substance for the ink mark 2, for example, a substance havingresol resin as a main component is used which hardens due to heating(for 20 minutes to one hour at a temperature of 150 degrees centigrade),and is applied to a height of, for example, 20 μm or less. Further, anoil based fast-drying ink may also be used.

Next, a protective tape 2 is affixed on a surface 1a of the substrate 1that has been applied with the ink marks 2, as shown in FIG. 1B.

This protective tape 3 is constructed from, for example, an acrylicfiber ultra-violet curing adhesive layer 31 and a polyolefine fiber basematerial film 32. The base material film 32 is approximately 110 μmthick and the thickness of the adhesive layer 31 is set to be equal toor greater than the thickness of the ink marks 2 applied to the surface1a of the substrate 1. FIG. 1C is an enlarged view of the affixedportion of the protective tape 3. For example, if the thickness of theink mark is taken to be t1 and the thickness of the adhesive layer 31 istaken to be t2, then t1 is set to be less than or equal to t2. In thisway, when the protective tape 3 is being affixed, the ink marks 2 areburied within the adhesive layer 31 and the surface of the base materialfilm 32 can be made flat.

Further, by making the thickness t2 of the adhesive layer 31, forexample, 25 μm when the thickness t1 of the ink marks is, for example,20 μm, an adhesive layer 31 of thickness 5 μm remains between the inkmark 2 and the base material film 32. This adhesive layer 31 is servedas a pressure buffering material during the grinding of the lowersurface of the substrate 1 in a later process.

Next, the process for grinding the lower surface 1b of the substrate 1is carried out, as shown in FIG. 2A. The previously described protectivetape 3 is affixed to the surface 1a of the substrate 1. The lowersurface side of the substrate 1 is then pressed against a grinding wheel(not shown in the drawings) under these conditions and grinding of thelower surface of the substrate 1 is carried out. This grinding is aprocess known as back grinding and is necessary for making the substrate1 thin. Further, at the grinding of the lower surface of the substrate1, the surface of this protective tape 3 is flat because the protectivetape 3 is affixed on the surface 1a of the substrate 1 and the thicknessof the adhesive layer 31 is equal to or greater than the thickness ofthe ink marks 2.

With this so-called "back grinding", when pressure is exerted by thegrinding wheel (not shown in the drawings) against the lower surface ofthe substrate 1, a uniform grinding pressure is exerted on the surfaceof the substrate 1 and the generation of cracking and breaking off inthe substrate 1 is suppressed.

When the thickness of the adhesive layer 31 is made to be thicker thanthe thickness of the ink marks 2, the adhesive layer 31 between the inkmarks 2 and the base material film 32 serves as a buffer material andthe application of pressure from the ink marks 2 to the substrate 1 in aconcentrated manner can be suppressed. In the case of, for example, asilicon wafer 6 inches in diameter and 620 μm in thickness, a thinnessof 200 μm to 250 μm can be achieved as a result of this grinding of thelower surface of the substrate 1.

After the lower surface of the substrate 1 has been ground, the adhesivelayer 31 for the protective tape 3 is irradiated with, for example, 1000mJ/cm² of ultra-violet light so as to be hardened. By applying theadhesive layer 31 that hardens due to irradiation with ultra violetlight so that the adhesive strength is lowered, the protective layer canbe peeled away in the following steps without any adhesive remaining.Washing of the substrate 1 is therefore not necessary because theprotective tape 3 can be peeled off without any adhesive remaining andit is therefore no longer necessary to take into consideration peelingof the ink mark 2 due to washing.

Under these conditions, the substrate 1 is transported and the nextdicing process is proceeded with. The protective tape 3 prevents dustfrom sticking and damage from being incurred while the substrate 1 isbeing transported.

Next, a dicing tape 4 is applied to the lower side 1b of the substrate 1for carrying out the dicing process, as shown in FIG. 2B.

When the substrate 1 is being diced, the protective tape 3, whoseadhesive layer 31 has been hardened for lowering the adhesive strengthin the previous process, is peeled off. The protective tape 3 may alsobe peeled off before the dicing tape 4 is adhered to the substrate 1,depending on the relationship with the dicing apparatus, etc.

Peeling off of the ink marks 2 together with the protective tape 3 whilethe protective tape 3 is being peeled off may be prevented by making theadhesive strength of the adhesive layer 31 for the protective tape 3smaller than the adhesive strength with which the ink marks 3 are fixedto the substrate 1.

Next, a dicing process is carried out where the substrate 41 is cut (forexample, full-cut) along scribe lines 41, as shown in FIG. 2C so as todivide the substrate 1 into individual members 10.

The members of the members 10 that have not been applied with an inkmark 2 (non-defective) are then detected by an image processing deviceemploying a CCD (charge-coupled device) camera and picked-up. When themembers 10 are semiconductor chips, is picked-up a non-defective member10 by a die bonder to carry out bonding, for example, to a lead framedie pad (not shown in the drawings).

According to this kind of manufacturing method, the members 10 can bemade thin without the occurrence of cracking or breaking off even whendefective or non-defective identification is made with an ink markmethod.

A base material film 32 for the protective layer 3 applied to the firstembodiment may be the one that is self-peeled as a result of receiving aprescribed energy. Further, the adhesive layer 31 may be comprised of athermal foam peeling material or surface active agent-containingmaterial other than an ultra-violet curing material.

Next, a manufacturing method for members for a second embodiment of thepresent invention will be described. FIG. 3A through FIG. 3C areschematic cross-sectional views illustrating a first representative ofthe second embodiment and FIG. 4A and FIG. 4B are schematiccross-sectional views illustrating a second representative of the secondembodiment.

The target of the manufacturing in this second embodiment is the members10 and the substrate 1 used in the manufacturing is the same as for thefirst embodiment.

First, in this second embodiment, the characteristics of the pluralityof members 10 formed on the substrate 1 are evaluated. Ink marks arethen applied to members that are deemed to be defective and a protectivetape 3 is then stuck onto the surface 1a of the substrate 1 as shown inFIG. 3A.

A resin for which, for example, a resol resin is the main component,that hardens as a result of heating (at 150° C. for 20 minutes to onehour) is used for the ink marks 2, and is applied, for example, to aheight of 20 μm or less.

The protective tape 3 of the second embodiment comprises, for example,an ultra-violet curing acrylic fiber adhesive layer 31 and aself-peeling backing material film 33. As the self-peeling backingmaterial film 33, for example, thermally shrinkable polyolefine fiber ofa thickness of about 40 μm that can be shrank and peeled at atemperature of 70° to 80° C. is taken.

In the case of a thermal foam peeling tape, a polyolefine fiber orpolyester fiber backing material film 33 with a thickness of, forexample, about 80 μm is used with micro capsules (not shown in thedrawings) of 5 to 15 mm in size being mixed within the acrylic fiberadhesive layer 31.

With this thermal foam peeling tape, gas (for example, an isobutanegroup gas) sealed inside the capsules is expanded (to a volume a fewtens of times the size) by heating to swell the micro capsules. In thisway, the adhesive strength of adhesive layer 31 is lowered to make thetape peel by itself from the affixing object. The amount of residualadhesive left on the affixing object after self-peeling can be reducedby ensuring the adhesive layer 31, in which the micro capsules aremixed, to have a high resistance to heat.

In the case of the protective tape 3 having the surface activeagent-containing adhesive layer 31, a self-peeling backing material film33 comprised of an about 40 μm thick thermally shrinkable polyolefinefiber is used in combination with the surface active agent-containingadhesive layer 31. At this surface active agent-containing adhesivelayer 31, the surface active agent is dissolved by soaking the tape inhot water of a temperature of 70° to 80° C. so that the adhesivestrength of the adhesive layer 31 can be reduced. Further, peeling-offwith shrinking can be achieved at 70° to 80° C. by combining this kindof surface active agent containing type of adhesive layer 31 and theself-peeling backing material film 33 described previously.

The thickness of the adhesive layer 31 is set to be equal to or greaterthan the thickness of the ink marks 2, as was the case for the firstembodiment. The ink marks 2 therefore become buried within the adhesivelayer 31, as shown in FIG. 1C and the surface of the self-peelingbacking material film 33 is made flat, as shown in FIG. 3A. Also, anadhesive layer 31 remains between the ink marks 2 and the self-peelingbacking material film 33 by making the adhesive layer 31 thicker thanthe ink marks 2. The adhesive layer 31 is then used as a pressure buffermaterial for the process of grinding the substrate 1.

Next, as shown in FIG. 3B, the process of grinding the lower surface 1bof the substrate 1 is carried out. In this grinding process, the lowerside 1b of the substrate 1 is ground by applying pressure to a grindingwheel (not shown in the drawings) from the lower side 1b of thesubstrate 1 with the protective tape, which is attached to the surfaceof the substrate 1, being set under.

At this time, pressure is uniformly applied to the substrate 1 becausethe surface of the protective tape 3 is flat. Further, pressureconcentration at the portions for the ink marks 2 can be relieved by theadhesive layer 31 between the ink marks 2 and the self-peeling backingmaterial film 33 when the adhesive layer 31 is thicker than the inkmarks 2.

This means that grinding of the lower surface can be carried out withoutcracking or breaking off even if ink marks 2 are applied.

Next, in this second embodiment, the dicing and ultraviolet irradiationcuring processes shown in FIG. 3C are proceeded with without peeled offthe protective tape 3 attached to the surface 1a of the substrate 1.

Here, transportation to the dicing apparatus (not shown in the drawings)is carried out with the protective tape 3 attached and full-cutting iscarried out along the scribe lines 41 with the dicing tape 4 stuck on.The substrate 1 is therefore divided into a number of members 10 withthe protective tape 3 still attached. After the dicing is completed, theadhesive layer 31 is hardened by irradiation with, for example,approximately 200 mJ/cm² of ultra-violet light and the adhesive strengthis lowered.

By applying the ultra-violet curing adhesive layer 31, the protectivetape 3 can be peeled off in later processes without any residualadhesive and washing becomes unnecessary. The hardening by ultra-violetirradiation may be carried out before the silver paste curing followingthe die bonding. This is effective in the case where the adhesivestrength is required to be maintained in order to prevent the protectivetape from peeling-off that may occur depending on the chip-size or thekind of die bonder.

It is not necessary to carry out hardening through irradiation withultra-violet rays after dicing when a thermal foam peeling layer orsurface active agent-containing layer is used as the adhesive layer 31.

Next, the process for taking out only non-defective members of thedivided members 10 is carried out, as shown in FIG. 4A. Here, the inkmarks 2 are detected by an image processing device employing a CCDcamera etc. Only non-defective members of the members 10 without inkmarks 2 applied are then raised up by a raising pin 51 and then held upby vacuum suction using a collet 5. The surfaces of the members 10 arenot damaged or attached with dust as a result of coming into contactwith the collet 5 because the protective tape 3 is still attached to thesurfaces of the members 10.

Next, the die bond and protective tape for the taken out members 10 istaken off, as shown in FIG. 4B.

The members taken out by the collet 5 (refer to FIG. 4A in the previousprocess are then mounted on a mounting frame 6 such as a lead frame viasilver paste (not shown in the drawings).

After the die bonding, hot air of a temperature of about 100° to 150° C.is blown so that the self-peeling backing material film 33 peels off byitself due to thermal shrinking and is removed.

For example, in the case of the self-peeling backing material film 33,which thermally shrinks and peels, shrinks when heated for five to tenseconds at a temperature of 80° to 100° C. to cause self-peeling.Further, in the case of the thermal foam peeling type, foaming materialsuch as expandable gas enclosed micro capsules within the adhesive layer31 foams due to heating for one minute at a temperature of about 100° C.This lowers adhesive strength as a result to cause self-peeling. It isalso possible for the self-peeling of the protective tape 3 to becarried out at the same time when the members 10 are heated for curingthe silver paste.

It becomes therefore possible to easily remove the protective tape 3 byits self-peeling even if the substrate 1 has been divided intoindividual members 10. That is, by using this kind of protective tape 3,the protective tape 3 does not have to be removed until the members 10have been mounted on a prescribed mounting frame. This provides thegreatest possible protection to the surfaces of the members 10 fromdamage or dust adhesion even during conveyance between each of theprocesses.

When a protective tape having a surface active agent-containing adhesivelayer 31 is used, tape peeling carried out after dicing together withprotective tape 3 becomes being facilitated since surface active-agentin the vicinity of the cut surface is dissolved by a large amount ofcutting water used during the dicing process. Washing of the memberswith hot water at a temperature of 70° to 80° C. is then carried outwith the dicing tape still being attached so that the backing materialfilm 33 is thermally shrank, self-peels, and is then removed, and thesurface active agent-containing adhesive layer 31 on the surfaces of themembers 10 is also removed.

In this second embodiment, a description has been given of an exampleemploying a protective tape 3 that self-peels as a result of heating.The present invention, however, is not limited to this and protectivetape 3 that self-peel due to other kinds of energy such as opticalenergy are also possible.

Further, in FIGS. 1 to 4 used in the description of the first and secondembodiments, manufacturing conditions were shown where a silicon waferwas taken as the substrate 1 for the members 10 comprising device chips.However, the same applies even if an optical glass plate or a quartzglass plate is used as the substrate 1 and members comprised by colorfilters are manufactured. In this case, the grinding of the lowersurface of the substrate 1 can be replaced by polishing of the lowersurface.

Moreover, the same also applies even if these embodiments are applied tothe manufacture of polysilicon TFT liquid crystal display devices. Here,at the time of forming a TFT for the polysilicon TFT liquid crystaldisplay device, prescribed characteristic evaluations are carried outafter a thin film of, for example, polysilicon, plasma nitride or SiO₂etc. formed on the lower surface of a substrate of quartz etc. isremoved by etching. These characteristic evaluations are carried out byapplying ink marks are applied to defective chips instead of performingmap data processing. The lower surface of the quartz glass substrate isthen polished to remove the thin film with the protective tape 3 of theaforementioned embodiments being attached to the TFT surface. Afterthis, the protective tape 3 is removed as described above, by which thesame merit of improved manufacturing yield, productivity and quality canbe obtained as above.

As described above, according to the method of manufacturing members inthe present invention, the following results are obtained. That is,according to the present invention, the lower surface of the substrateis ground after characteristic measurements, so that the substrate doesnot crack or break off due to pin pressure etc. at the time ofcharacteristic measurements even if the substrate is made large andthin.

Further, uniform grinding pressure is applied when the lower surface ofthe substrate is ground after characteristic measurements by making theadhesive layer for the protective tape thicker than the ink marksapplied to defective members, and thus cracking and breaking off of thesubstrate can be prevented.

Still further, this ink mark method adopted in recording information onunacceptable members allows the information on unacceptable members tobe surely transmitted with the transferred substrate.

Moreover, it is possible to easily peel the protective tape inindividual member units by using the self-peeling backing material film.As a result of this, it is not necessary to peel off the protective filmthrough the grinding of the lower surface of the substrate, thedividing, converting, and bonding of the members. This provides maximumeffect of protection of surfaces of the members from damage or dustadhesion etc.

As a result of this, a plurality of thin members can be reliablyproduced from a large substrate while giving a large yield.

What is claimed is:
 1. A method of manufacturing members, with aplurality of members being formed together on a single substrate and thesubstrate being cut in such a manner as to be divided into individualmembers after a characteristic evaluation of the members is carried out,the method of manufacturing comprising the steps of:carrying out theevaluation of the characteristics and applying ink marks of a prescribedheight to surfaces of members deemed to have been defective; affixing aprotective tape having an adhesive layer of a thickness equal to orgreater than the height of the ink marks to the surface of thesubstrate; and cutting the substrate in such a manner as to be dividedinto individual members after a lower surface of the substrate has beenground or polished.
 2. A method of manufacturing members according toclaim 1, wherein the adhesive strength of the adhesive layer for theprotective tape is smaller than the adhesive strength of the ink markswith respect to the substrate.
 3. A method of manufacturing members,with a plurality of members being formed together on a single substrateand the substrate being cut in such a manner as to be divided intoindividual members after a characteristic evaluation of the members iscarried out, the method of manufacturing comprising the stepsof:carrying out the evaluation of the characteristics and applying inkmarks of a prescribed height to surfaces of members deemed to have beendefective; affixing a self-peeling protective tape having an adhesivelayer of a thickness equal to or greater than the height of the inkmarks to the surface of the substrate; cutting the substrate togetherwith protective tape so as to divide the substrate into individualmembers after a lower surface of the substrate has been ground orpolished with the protective tape affixed; and applying a prescribedenergy to each individual member after dividing, in such a manner thatthe protective tape is made to peel itself off.
 4. A method ofmanufacturing members according to claim 3, wherein the self-peelingprotective tape peels itself in response to thermal energy.
 5. A methodof manufacturing members according to claim 1, wherein the adhesivelayer of the protective tape is of an ultra-violet curing tape.
 6. Amethod of manufacturing members according to claim 1, wherein theadhesive layer of the protective tape is of a thermal foam peeling type.7. A method of manufacturing members according to claim 1, wherein theadhesive layer of the protective tape is of a surface activeagent-containing type.